Electronic devices and methods for detecting foreign object on connector

ABSTRACT

An electronic device including a connector having a plurality of pins, and a detection circuit having at least one of a pull-up circuit and a pull-down circuit, and a connection circuit between a first pin and a second pin of the plurality of pins, the detection circuit is configured to select the first pin and the second pin, measure an impedance between the selected first pin and second pin by controlling a connection of the connection circuit and the at least one of the pull-up circuit and the pull-down circuit, and generate a detection signal indicating a presence or an absence of a foreign object on the connector based on the measured impedance.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. application Ser. No.16/781,357, filed Feb. 4, 2020, which is a Continuation of U.S.application Ser. No. 16/053,155, filed on Aug. 2, 2018, which claimspriority under 35 U.S.C. § 119 to Korean Patent Application No.10-2017-0115908, filed on Sep. 11, 2017, in the Korean IntellectualProperty Office, the disclosure of each of which is incorporated hereinin its entirety by reference.

BACKGROUND

Some example embodiments relate to electronic devices, and moreparticularly, to electronic devices and methods for detecting a foreignobject on a connector.

An electronic device may include a connector and may communicate with anexternal electronic device via a cable inserted in the connector. Whenforeign objects are introduced into the connector, some pins on theconnector may be short-circuited, corroded or broken. Also, when theelectronic device is charged through the cable, electric current mayflow between some of the pins on the connector, resulting in excessivepower consumption by the electronic device, which may cause damage tothe electronic device.

SUMMARY

According to some example embodiments, there is provided an electronicdevice including a plurality of pins and a detection circuit. Thedetection circuit including at least one of a pull-up circuit and apull-down circuit, and a connection circuit between a first pin and asecond pin of the plurality of pins. The detection circuit is configuredto select the first pin and the second pin. The detection circuit isfurther configured to measure an impedance between the selected firstpin and second pin by controlling a connection of connection circuit andthe at least one of the pull-up circuit and the pull-down circuit.Furthermore, the detection circuit is configured to generate a detectionsignal indicating a presence or an absence of a foreign object on theconnector based on the measured impedance.

According to some example embodiments, there is provided an electronicdevice including a connector having a plurality of pins and a powerdelivery integrated circuit (PDIC). The PDIC is configured to generate adetection signal indicating presence or absence of a foreign object onthe connector. The PDIC includes a selection circuit configured toselect a first pin and a second pin among the plurality of pins. ThePDIC further includes a pull-up circuit configured to provide a powersupply voltage to a first node connected to the first pin and a secondnode connected to the second pin. The PDIC further includes a pull-downcircuit configured to provide a ground voltage to the first node and thesecond node; a connection circuit including a resistor between the firstnode and the second node. Furthermore, the PDIC includes a controllerconfigured to generate a detection signal based on a first voltagesignal of the first node and a second voltage signal of the second node.

According to some example embodiments, there is provided a foreignobject detecting method performed by an electronic device including acontroller. The method includes selecting first and second pins among aplurality of pins included in a connector. The method further includesmeasuring an impedance between the selected first and second pins usingthe controller. The method further includes generating a detectionsignal indicating presence or absence of a foreign object on theconnector based on the measured impedance. Furthermore, the methodincludes providing a foreign object alarm message according to thegenerated detection signal.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings attached hereto may not accord to a scale and mayillustrate exaggerated or reduced components, for convenience ofillustration.

FIG. 1 is a block diagram schematically illustrating an electronicdevice according to some example embodiments;

FIG. 2 shows an example of a connector according to some exampleembodiments;

FIG. 3 is a detailed block diagram of a detection circuit of FIG. 1,according to some example embodiments;

FIG. 4 is a circuit diagram showing a detection circuit in which each ofthe pull-up circuit and pull-down circuit includes two current sources,two resistors and two selectors, according to some example embodiments;

FIG. 5 is a circuit diagram illustrating a modification of the detectioncircuit of FIG. 4 in which each of the pull-up circuit and pull-downcircuit includes two current sources, according to some exampleembodiments;

FIG. 6 is a circuit diagram illustrating a modification of the detectioncircuit of FIG. 4 in which each of the pull-up circuit and pull-downcircuit includes two resistors, according to some example embodiments;

FIG. 7A shows an example of a detection circuit 200 a measuring animpedance between a selected first pin and a selected second pin,according to some example embodiments and FIG. 7B is an equivalentcircuit diagram of FIG. 7A;

FIG. 8A shows an example of a detection circuit measuring an impedancebetween selected pins and a ground voltage terminal, according to someexample embodiments and FIG. 8B is an equivalent circuit diagram of FIG.8A;

FIG. 9A shows an example of a detection circuit measuring both endvoltage of an impedance between a selected first pin and a selectedsecond pin, according to some example embodiments and FIG. 9B is anequivalent circuit diagram of FIG. 9A;

FIG. 10A shows an example of a detection circuit measuring whetherselected first and second pins are open using the pull-up circuit,according to some example embodiments, and FIG. 10B is an equivalentcircuit diagram of FIG. 10A;

FIG. 11A shows an example of a detection circuit measuring whetherselected first and second pins are open using the pull-up circuit andthe pull-down circuit, according to some example embodiments, and FIG.11B is an equivalent circuit diagram of FIG. 11A;

FIG. 12A shows an example of a detection circuit measuring leakagecurrent of selected first and second pins, according to some exampleembodiments, and FIG. 12B is an equivalent circuit diagram of FIG. 12A;

FIG. 13 shows an example of a detection circuit measuring the voltagesof selected first and second pins, according to some exampleembodiments;

FIG. 14 is a block diagram illustrating an example of the detectioncircuit of FIG. 3 including an alarm message generator, according tosome example embodiments;

FIG. 15 is a block diagram illustrating a detection circuit in which theVBUS pin A4 is connected to the voltage signal generation circuit,according to some example embodiments;

FIG. 16 is a circuit diagram showing the detection circuit of FIG. 15,according to some example embodiments;

FIG. 17 is a block diagram illustrating an electronic device including aPDIC, according to some example embodiments;

FIG. 18 is a block diagram illustrating an electronic device including aPDIC, an AP, an IF-PMIC and a PMIC, according to some exampleembodiments;

FIG. 19 is a flowchart showing a foreign object detection method of anelectronic device according to some example embodiments; and

FIG. 20 is a flowchart illustrating a method of measuring impedanceaccording to some example embodiments.

DETAILED DESCRIPTION

Hereinafter, some example embodiments will be described in detail withreference to the accompanying drawings.

FIG. 1 is a block diagram schematically illustrating an electronicdevice 10 according to some example embodiments.

Referring to FIG. 1, the electronic device 10 may include a connector100 and a detection circuit 200. In some example embodiments, theelectronic device 10 may be a USB device capable of communicating withan external electronic device via a USB interface. However, theelectronic device 10 is not limited to a USB device, and may be anyelectronic device capable of communicating with the external electronicdevice via an interface according to another communication standard.Furthermore, the electronic device 10 may be any electronic deviceincluding an audio jack terminal such as an ear jack terminal.

The connector 100 may be a receptacle or a plug. In some exampleembodiments, the connector 100 may be connected to an external cable andmay perform communication between the external device and the electronicdevice 10 via the cable. The detection circuit 200 may be electricallyconnected to the connector 100 to detect a presence or absence offoreign objects on the connector 100. Accordingly, the detection circuit200 may be referred to as a ‘foreign object detection circuit’. Theelectronic device 10 may further include an application processor (AP)300 that controls the overall operation of the electronic device 10.According to some example embodiments, operations described herein asbeing performed by the application processor 300 may be performed by atleast one processor executing program code that includes instructionscorresponding to the operations. The instructions may be stored in amemory. The term ‘processor,’ as used in the present disclosure, mayrefer to, for example, a hardware-implemented data processing devicehaving circuitry that is physically structured to execute desiredoperations including, for example, operations represented as code and/orinstructions included in a program. In at least some example embodimentsthe above-referenced hardware-implemented data processing device mayinclude, but is not limited to, a microprocessor, a central processingunit (CPU), a processor core, a multi-core processor, a multiprocessor,an application-specific integrated circuit (ASIC), and a fieldprogrammable gate array (FPGA).

The connector 100 may include a plurality of pins configured to becoupled to an external cable. A signal may be transmitted or received,or electric power may be transmitted, through the plurality of pins.Since the plurality of pins are physical terminals having electricalconductivity and the plurality of pins are spaced apart from each otherby a determined distance, adjacent pins may be insulated from each otherin a normal state in which no foreign object is introduced into theconnector 100. In some example embodiments, the cable may be a USBType-C cable and the connector 100 may be a USB Type-C receptacle. USBType C is a physical specification of a terminal or a socket for a USBdevice or a cable and defines the standards for new receptacles, plugs,and cables that are compatible with existing USB interfaces.Hereinafter, the USB type-C receptacle will be described in detail as anexample of the connector 100 with reference to FIG. 2. However, someexample embodiments are not limited thereto, and the connector 100 maybe a USB type-C plug.

FIG. 2 shows an example of a connector 100 a according to some exampleembodiments.

Referring to FIG. 2, the connector 100 a may be a USB type-C receptacleand may include pins A1 to A12 of a first row and pins B1 to B12 of asecond row. The pins A1 to A12 of the first row and the pins B1 to B12of the second row may have a symmetrical structure by which theconnector 100 a and a USB type-C cable may be normally connectedregardless of directions of the connector 100 a and the USB type-Ccable. Various terms to be described below may be understood by thoseskilled in the art through a USB type-C standard document, and thus adetailed description thereof will be omitted.

The connector 100 a may support data communication of various speeds. Asan example, the connector 100 a may include TX and RX pins A2, A3, A10,A11, B2, B3, B10, and B11 that support high speed data communicationaccording to a first standard (e.g., USB 3.1) and D pins A6, A7, B6, andB7 that support low speed data communication according to a secondstandard (e.g., USB 2.0). Also, each of the pins A1 to A12 of the firstrow and the pins B1 to B12 of the second row may perform a uniquefunction. For example, VBUS pins A4, A9, B4, and B9 may correspond topins that supply a power voltage, GND pins A1, A12, B1 and B12 maycorrespond to pins that transmit a ground voltage and SBU pins A8 and B8may correspond to sideband use pins.

On the other hand, an electronic device (for example, 10 in FIG. 1)including the connector 100 a may perform bidirectional communication.For example, the electronic device 10 may operate as a host device(e.g., a downstream facing port (DFP)) or as a slave device (e.g., anupstream facing port (UFP) when connected to an external device via aUSB interface. Alternatively, the electronic device 10 may operate as adual role port (DRP), where the electronic device 10 may adaptivelychange between a role of the host device (e.g., DFP) and a role of theslave device (e.g., UFP). The role of the electronic device may bespecified via CC (Configuration Channel) pins A5 and B5. As an example,in the case of a USB interface, data connection and control may beperformed by digital communication via a CC1 pin A5 and a CC2 pin B5.

According to a model of the electronic device, only some of theplurality of pins A1 to A12 and B1 to B12 on the connector 100 a may beused. As an example, some models may not use one or more of the multipleGND pins A1, A12, B1, and B12. As another example, some models may notuse at least one of the pins A2, A3, A10, A11, B2, B3, B10, and B11associated with high speed data communication. A pin not used in theelectronic device may not be electrically connected to an integratedcircuit in the electronic device associated with communication and maybe opened.

As described above, since the connector 100 a includes a larger numberof the pins A1 to A12 and B1 to B12 than conventional ones, an internalstructure may be dense and an influence of foreign objects, for example,a possibility of a short between adjacent pins, may be high, which maydamage the electronic device. Accordingly, a method of detecting whetherforeign objects are present on the connector 100 a and providing aforeign object alarm message to a user according to a result of thedetection would be desirable. Hereinafter, some example embodiments inwhich the connector 100 a is a USB type-C connector will be described.However, some example embodiments may be equally or similarly applied toconnectors of other structures.

Referring again to FIG. 1, the detection circuit 200 may select firstand second pins of the plurality of pins included in the connector 100,and measure impedance between the selected first and second pins, thatis, pin-to-pin impedance. Further, the detection circuit 200 maygenerate a detection signal DS indicating whether foreign objects arepresent on the connector 100 based on the measured pin-to-pin impedance.In some example embodiments, the detection circuit 200 may generate theforeign object alarm message when foreign objects are present on theconnector 100 or limit voltage or current supplied to the VBUS pins A4,A9, B4, and B9 of the plurality of pins. Specific configuration andoperation of the detection circuit 200 will be described in more detailwith reference to FIGS. 3 and 4.

The AP 300 may receive the detection signal DS from the detectioncircuit 200 and generate the foreign object alarm message based on thereceived detection signal DS or limit voltage or current supplied to theVBUS pins A4, A9, B4, and B9 of the plurality of pins. In some exampleembodiments, the AP 300 may limit the voltage or the current supplied tothe VBUS pins A4, A9, B4, and B9 by controlling a Power ManagementIntegrated Circuit (PMIC) (e.g., 700 in FIG. 18) or an Interface(IF)-PMIC (e.g., 500 in FIG. 18). In some example embodiments, the AP300 may be implemented as a System-On-Chip (SoC).

An electronic device according to some example embodiments may includeat least one of, for example, a smartphone, a tablet personal computer,a mobile phone, a video phone, an e-book reader, a desktop personalcomputer (PC), a laptop personal computer (PC), a netbook computer, aworkstation, a server, a personal digital assistant (PDA), a portablemultimedia player (PMP), an MP3 player, a mobile medical device, acamera, and a wearable device. According to some example embodiments,the wearable device may include at least one of an accessory type (e.g.,a watch, a ring, a bracelet, a bracelet, a necklace, a spectacle, acontact lens or a head-mounted-device (HMD)), a texture or clothingintegration type (e.g., electronic apparel), a body attachment type(e.g., skin pads or tattoos), and bioimplantable (e.g., implantablecircuits).

FIG. 3 is a detailed block diagram of the detection circuit 200 of FIG.1, according to some example embodiments. Referring to FIG. 3, thedetection circuit 200 may include a selection circuit 210, a voltagesignal generation circuit 220, a converting circuit 230, and a foreignobject detection block 240. In some example embodiments, the detectioncircuit 200 may be implemented as part of a Power Delivery IC (PDIC).

The selection circuit 210 may be connected to a plurality of pins P1 toPn and may select first and second ones of the plurality of pins P1 toPn. Here, n is an integer of 2 or more, and may be variously changedaccording to some example embodiments. In some example embodiments, nmay be 24, and the selection circuit 210 may be connected to theplurality of pins A1 through A12 and B1 through B12 of FIG. 2. In someexample embodiments, n may be 8, and the selection circuit 210 may beconnected to some of the plurality of pins A1 through A12 and B1 throughB12 of FIG. 2. For example, the pins A1, A4 through A8, and B5 and B8 inFIG. 2 may be connected to the selection circuit 210, but some exampleembodiments are not limited thereto. Also, the selection circuit 210 mayoutput a first input IN1 and a second input IN2 from the selected firstand second pins. However, some example embodiments are not limitedthereto, and in some example embodiments, the selection circuit 210 maybe implemented to select three or more pins.

The voltage signal generation circuit 220 may receive the first andsecond inputs IN1 and IN2 from the selection circuit 210 and generatefirst and second voltage signals IN1 a and IN2 a respectivelycorresponding to the first and second inputs IN1 and IN2. The firstvoltage signal IN1 a may have a voltage level according to a state ofthe first pin. The second voltage signal IN2 a may have a voltage levelaccording to a state of the second pin. For example, a state of a pinmay be a voltage level applied to the pin, whether the pin is open,whether the pin is shorted to an adjacent pin, and so on. Specifically,the voltage signal generation circuit 220 may include a pull-up circuit221, a pull-down circuit 222, and a connection circuit 223. Aconfiguration of the voltage signal generation circuit 220 will bedescribed in detail with reference to FIG. 4.

The converting circuit 230 may receive the first and second voltagesignals IN1 a and IN2 a and perform analog-to-digital converting(hereinafter referred to as ADC) on the first and second voltage signalsIN1 a and IN2 a to generate first and second digital signals IN1 d andIN2 d. The foreign object detection block 240 may receive the first andsecond digital signals IN1 d and IN2 d and generate a detection signalindicating whether foreign objects are present on the plurality of pinsP1 to Pn based on the first and second digital signals IN1 d and IN2 d.In some example embodiments, the foreign object detection block 240 maybe implemented as a Micro Controller Unit (MCU) or other hardware. Theoperations described herein as being performed by the foreign objectdetection block 240 may be performed by the MCU executing firmwareinstructions stored in a memory.

FIG. 4 is a circuit diagram showing the detection circuit 200 accordingto some example embodiments. Referring to FIG. 4, each of the pull-upcircuit and pull-down circuit of the detection circuit 200 includes twocurrent sources, two resistors and two selectors. The detection circuit200 may be electrically connected to the plurality of pins PN. Forexample, the plurality of pins PN may be the CC1 pin A5, the CC2 pin B5,the SBU1 pin A8, the SBU2 pin B8, the DP pin A6, the DM pin A7, the VBUSpin A4, and the GND pin A1. However, types and number of the pins PNconnected to the detection circuit 200 may be variously changedaccording to some example embodiments.

The selection circuit 210 may include first and second selectors 211 and212. The first selector 211 may select a first pin of the plurality ofpins PN according to a first input selection signal INSEL1, output thefirst input IN1 from the selected first pin, and provide the first inputIN1 to a first node ND1. Similarly, the second selector 212 may select asecond pin of the plurality of pins PN according to a second inputselection signal INSEL2, output the second input IN2 from the selectedsecond pin, and provide the second input IN2 to a second node ND2. Insome example embodiments, each of the first and second selectors 211 and212 may be implemented as a multiplexer. In some example embodiments,the first and second input selection signals INSEL1 and INSEL2 may be3-bit digital signals. In some example embodiments, the first and secondinput signals INSEL1 and INSEL2 may be generated from a controller(e.g., 260 of FIG. 17) included in the PDIC.

The pull-up circuit 221 may include a first current source CS1, a firstresistor R1, a first source selector 2211, and a first pull-up selectionswitch SW1 connected to a power voltage terminal VDDA. The first sourceselector 2211 may select one of the first current source CS1 and thefirst resistor R1 as a pull-up device according to a first source selectsignal SRC1. The first pull-up selection switch SW1 may connect anoutput terminal of the first source selector 2211 to the first node ND1according to a first pull-up selection signal PU1 The pull-up circuit221 may further include a second current source CS2, a second resistorR2, a second source selector 2212 and a second pull-up selection switchSW2 connected to the power voltage terminal VDDA. The second sourceselector 2212 may select one of the second current source CS2 and thesecond resistor R2 as the pull-up device according to a second sourceselection signal SRC2. The second pull-up selection switch SW2 mayconnect an output terminal of the second source selector 2212 to thesecond node ND2 according to the second pull-up selection signal PU2.

The pull-down circuit 222 may include a third current source CS3, athird resistor R3, a first sync selector 2221 and a first pull-downselection switch SW3 connected to a ground voltage terminal VSSA. Thefirst sync selector 2221 may select one of the third current source CS3and the third resistor R3 as the pull-down device according to a firstsync select signal SNK1. The first pull down selection switch SW3 mayconnect the output terminal of the first sync selector 2221 to the firstnode ND1 according to the first pull down selection signal PD1. Thepull-down circuit 222 may further include a fourth current source CS4, afourth resistor R4, a second sync selector 2222 and a second pull downselection switch SW4 connected to the ground voltage terminal VSSA. Thesecond sync selector 2222 may select one of the fourth current sourceCS4 and the fourth resistor R4 as the pull-down device according to asecond sync select signal SNK2. The second pull down selection switchSW4 may connect the output terminal of the second sync selector 2222 tothe second node ND2 according to the second pull down selection signalPD2.

In some example embodiments, the first and second source selectors 2211and 2212 and the first and second sync selectors 2221 and 2222 may eachbe implemented as a multiplexer. In some example embodiments, the firstand second source select signals SRC1 and SRC2 and the first and secondsync select signals SNK1 and SNK2 may be 1-bit digital signals. In someexample embodiments, the first and second source select signals SRC1 andSRC2, the first and second sync select signals SNK1 and SNK2, the firstand second pull-up select signals PU1 and PU2, and the first and secondpull down selection signals PD1 and PD2 may be generated from acontroller (for example, 260 in FIG. 17) included in the PDIC. In someexample embodiments, each of the first through fourth current sourcesCS1 through CS4 may provide current of about 1 μA to about 1 mA. In someexample embodiments, each of the first through fourth resistors R1through R4 may be between about 1 KΩ and about 1 MΩ.

The connection circuit 223 may include a fifth resistor R5 and first andsecond connection selection switches SW5 and SW6. The fifth resistor R5and the first connection selection switch SW5 may be disposed betweenthe first and second nodes ND1 and ND2 and may be connected in serieswith each other. The second connection selection switch SW6 may bedisposed between the first and second nodes ND1 and ND2 and may beconnected in parallel with the fifth resistor R5 and the firstconnection selection switch SW5. The first connection selection switchSW5 may be turned on/off according to the first connection selectionsignal SEL1. The second connection selection switch SW6 may be turnedon/off according to the second connection selection signal SEL2. Thefirst and second connection selection signals SEL1 and SEL2 may begenerated from a controller (for example, 260 in FIG. 17) included inthe PDIC.

The converting circuit 230 may include first and second ADCs 231 and232. The first ADC 231 may receive the first voltage signal IN1 a of thefirst node ND1 and perform ADC on the received first voltage signal IN1a to generate the first digital signal IN1 d. The second ADC 232 mayreceive the second voltage signal IN2 a of the second node ND2 andperform ADC on the received second voltage signal IN2 a to generate thesecond digital signal IN2 d.

In some example embodiments, the foreign object detection block 240 maycalculate a pin-to-pin impedance between the first pin and the secondpin based on the first and second digital signals IN1 d and IN2 d andgenerate a detection signal DS based on the calculated pin-to-pinimpedance. For example, if the pin-to-pin impedance corresponds to anormal impedance, the foreign object detection block 240 may generatethe detection signal DS indicating that no foreign object is present,and if the pin-to-pin impedance does not correspond to the normalimpedance, the foreign object detection block 240 may generate thedetection signal DS indicating that a foreign object is present.

In some example embodiments, the foreign object detection block 240 maycalculate a first impedance between the first pin and the ground voltageterminal VSSA and a second impedance between the second pin and theground voltage terminal VSSA based on the first and second digitalsignals IN1 d and IN2 d and generate the detection signal DS based onthe calculated first and second impedances. In some example embodiments,the foreign object detection block 240 may determine whether the firstand second pins are opened based on the first and second digital signalsIN1 d and IN2 d and generate the detection signal DS according to aresult of the determination. Some example embodiments in which theforeign object detection block 240 detects a foreign object will bedescribed in detail with reference to FIGS. 7A to 13.

FIG. 5 is a circuit diagram illustrating a modification 200A of thedetection circuit 200 of FIG. 4 in which each of the pull-up circuit andpull-down circuit includes two current sources, according to someexample embodiments.

Referring to FIG. 5, the detection circuit 200A may correspond to amodification of the detection circuit 200 of FIG. 4. The abovedescription with reference to FIG. 4 may also be applied to thedescription of FIG. 5. Specifically, the detection circuit 200A may bedifferent from the detection circuit 200 of FIG. 4 in configurations ofa pull-up circuit 221A and a pull-down circuit 222A. Hereinafter, thepull-up circuit 221A and the pull-down circuit 222A will be mainlydescribed.

The pull-up circuit 221A may include the first current source CS1 andthe first pull-up selection switch SW1 that are connected to the powersupply voltage terminal VDDA. The first pull-up selection switch SW1 mayconnect the first current source CS1 to the first node ND1 according tothe first pull-up selection signal PU1 and may provide current to thefirst node ND1. Also, the pull-up circuit 221A may further include asecond current source CS2 and a second pull-up selection switch SW2 thatare connected to the power voltage terminal VDDA. The second pull-upselection switch SW2 may connect the second current source CS2 to thesecond node ND2 according to the second pull-up selection signal PU2 andmay provide current to the second node ND2.

The pull-down circuit 222A may include the third current source CS3 andthe first pull down select switch SW3 that are connected to the groundvoltage terminal VSSA. The first pull down selection switch SW3 mayconnect the third current source CS3 to the first node ND1 according tothe first pull down selection signal PD1 and may provide current to thefirst node ND1. The pull-down circuit 222A may further include thefourth current source CS4 and the second pull down selection switch SW4that are connected to the ground voltage terminal VSSA. The second pulldown selection switch SW4 may connect the fourth current source CS4 tothe second node ND2 according to the second pull down selection signalPD2 and may provide current to the second node ND2.

FIG. 6 is a circuit diagram illustrating detection circuit 200B in whicheach of the pull-up circuit and pull-down circuit includes tworesistors, according to some example embodiments.

Referring to FIG. 6, the detection circuit 200B corresponds to amodification of the detection circuit 200 of FIG. 4, and the abovedescription with reference to FIG. 4 may also be applied to thedescription of FIG. 6. Specifically, the detection circuit 200B may bedifferent from the detection circuit 200 of FIG. 4 in configurations ofa pull-up circuit 221B and a pull-down circuit 222B. Hereinafter, thepull-up circuit 221B and the pull-down circuit 222B will be mainlydescribed.

The pull-up circuit 221B may include the first resistor R1 and the firstpull-up selection switch SW1 that are connected to the power supplyvoltage terminal VDDA. The first pull-up selection switch SW1 mayconnect the first resistor R1 to the first node ND1 according to thefirst pull-up selection signal PU1. Also, the pull-up circuit 221B mayfurther include the second resistor R2 and the second pull-up selectionswitch SW2 that are connected to the power supply voltage terminal VDDA.The second pull-up selection switch SW2 may connect the second resistorR2 to the second node ND2 according to the second pull-up selectionsignal PU2.

The pull-down circuit 222B may include the third resistor R3 and thefirst pull down selection switch SW3 that are connected to the groundvoltage terminal VSSA. The first pull down selection switch SW3 mayconnect the third resistor R3 to the first node ND1 according to thefirst pull down selection signal PD1. Also, the pull-down circuit 222Bmay further include the fourth resistor R4 and the second pull-downselection switch SW4 that are connected to the ground voltage terminalVSSA. The second pull down select switch SW4 may connect the fourthresistor R4 to the second node ND2 according to the second pull downselect signal PD2.

In some example embodiments, a detection circuit may be implemented toinclude the pull-up circuit 221A of FIG. 5 and the pull-down circuit222B of FIG. 6. In some example embodiments, a detection circuit may beimplemented to include the pull-up circuit 221B of FIG. 6 and thepull-down circuit 222A of FIG. 5. In some example embodiments, adetection circuit may be implemented to include the pull-up circuit 221of FIG. 4 and the pull-down circuit 222A of FIG. 5 or the pull-downcircuit 222B of FIG. 6. In some example embodiments, a detection circuitmay be implemented to include the pull-up circuit 221A of FIG. 5 or thepull-up circuit 221B of FIG. 6 and the pull-down circuit 222 of FIG. 4.

Hereinafter, various operation examples of the detection circuit 200 ofFIG. 4 will be described with reference to FIGS. 7A to 13. The abovedescription with reference to FIGS. 4 to 6 may also be applied to FIGS.7A to 13, and a redundant description thereof will be omitted. In someexample embodiments, the pull-up circuit 221 of FIGS. 7A through 13 maybe replaced by the pull-up circuit 221A of FIG. 5 or the pull-up circuit221B of FIG. 6. Also, in some example embodiments, the pull-down circuit222 of FIGS. 7A through 13 may be replaced by the pull-down circuit 222Aof FIG. 5 or the pull-down circuit 222B of FIG. 6.

FIG. 7A shows an example of a detection circuit 200 a measuring animpedance between a selected first pin and a selected second pin,according to some example embodiments. FIG. 7B is an equivalent circuitdiagram of FIG. 7A.

Referring to FIGS. 7A and 7B, the detection circuit 200 a may measure animpedance between a selected first pin and a selected second pin. Forexample, the selected first pin may be the VBUS pin A4 and the selectedsecond pin may be the CC1 pin A5. Specifically, the first selector 211may select the VBUS pin A4 according to the first input selection signalINSEL1 and output the first input IN1 from the selected VBUS pin A4. Thesecond selector 212 may select the CC1 pin A5 according to the secondinput selection signal INSEL2 and output the second input IN2 from theselected CC1 pin A5. For example, the first input selection signalINSEL1 may be ‘110’ and the second input selection signal INSEL2 may be‘000’.

The first and second pull-up selection signals PU1 and PU2 and the firstpull down selection signal PD1 may be inactivated and the second pulldown selection signal PD2 may be activated. Also, the first connectionselection signal SEL1 may be activated and the second connectionselection signal SEL2 may be inactivated. Thus, the second pull downselection switch SW4 and the first connection selection switch SW5 maybe turned on. Also, the second sync selector 2222 may select the fourthresistor R4 as a pull-down device, and accordingly, the fourth resistorR4 and the second pull-down selection switch SW4 may be connected.

A state (hereinafter referred to as a “normal state”) where no foreignobject is present on the VBUS pin A4 and the CC1 pin A5 may be a statewhere a VBUS voltage is applied to the VBUS pin A4 and no voltage isapplied to the CC1 pin A5. Therefore, a voltage level of the first nodeND1 may be the same as the VBUS voltage, and a voltage level of thesecond node ND2 may have a voltage level distributed from the VBUSvoltage by the fourth resistor R4 and the fifth resistor R5. Forexample, when the VBUS voltage is 5 V and resistance values of thefourth resistor R4 and the fifth resistor R5 are the same as each other,the voltage level of the first node ND1 may correspond to 5 V, and thevoltage level of the second node ND2 may correspond to 2.5 V.

In the normal state, the first ADC 231 may receive the first voltagesignal IN1 a corresponding to the voltage level of the first node ND1and perform ADC on the received first voltage signal IN1 a to generatethe first digital signal IN1 d. The second ADC 232 may receive thesecond voltage signal IN2 a corresponding to the voltage level of thesecond node ND2 and perform ADC on the received second voltage signalIN2 a to generate the second digital signal IN2 d. The foreign objectdetection block 240 may receive the first and second digital signals IN1d and IN2 d and calculate a normal impedance between the first node ND1and the second node ND2 according to Ohm's law using the received firstand second digital signals IN1 d and IN2 d.

On the other hand, a short circuit may occur between the VBUS pin A4 andthe CC1 pin A5 in a state (hereinafter referred to as a “foreign objectstate”) where there is a foreign object on the VBUS pin A4 and the CC1pin A5. As a result, a resistance value between the VBUS pin A4 and theCC1 pin A5 may be reduced, for example, close to 0Ω. At this time,resistance between the VBUS pin A4 and the CC1 pin A5 and the fifthresistor R5 may be regarded as being connected in parallel. A parallelresistance value may be changed to a foreign object resistance valueclose to 0Ω. Therefore, the voltage level of the second node ND2 may behigher than a voltage level in the normal state, for example, 2.5V. Atthis time, the voltage level of the first node ND1 may correspond to thevoltage level in the normal state, for example, 5V.

The second voltage signal IN2 a corresponding to the voltage level ofthe second node ND2 in the foreign object state may be different fromthe second voltage signal IN2 a in the normal state, and accordingly thesecond digital signal IN2 d may be different from the second digitalsignal IN2 d in the normal state. The foreign object detection block 240may calculate the impedance between the first node ND1 and the secondnode ND2 according to Ohm's law using the received first and seconddigital signals IN1 d and IN2 d, where the calculated impedance may bedifferent from the normal impedance. Therefore, the foreign objectdetection block 240 may determine that a foreign object is detected on aconnector and may activate a detection signal.

FIG. 8A shows an example of a detection circuit 200 b measuring animpedance between selected pins and a ground voltage terminal, accordingto some example embodiments. FIG. 8B is an equivalent circuit diagram ofFIG. 8A.

Referring to FIGS. 8A and 8B, the detection circuit 200 b may measure animpedance between a selected first pin and a ground voltage terminal,and measure an impedance between a selected second pin and the groundvoltage terminal. For example, the selected first pin may be the SBU1pin A8 and the selected second pin may be the SBU2 pin B8. Specifically,the first selector 211 may select the SBU1 pin A8 according to the firstinput selection signal INSEL1, and output the first input IN1 from theselected SBU1 pin A8. The second selector 212 may select the SBU2 pin B8according to the second input selection signal INSEL2 and output thesecond input IN2 from the selected SBU2 pin B8. For example, the firstinput selection signal INSEL1 may be ‘010’ and the second inputselection signal INSEL2 may be ‘011’.

The first and second pull-up selection signals PU1 and PU2 may bedeactivated. The first and second pull down selection signals PD1 andPD2 may be activated. The first and second connection selection signalsSEL1 and SEL2 may be deactivated. Accordingly, the first and second pulldown selection switches SW3 and SW4 may be turned on. The first andsecond sync selectors 2221 and 2222 may also select the third and fourthresistors R3 and R4 as pull-down devices, respectively, and accordinglythe third resistor R3 and the first pull-down selection switch SW3 maybe connected, and the fourth resistor R4 and the second pull-downselection switch SW4 may be connected.

In a normal state in which there is no foreign object on the SBU1 pin A8and the SBU2 pin B8, a voltage level of the first node ND1 may have afirst voltage level corresponding to the third resistor R3 and a voltagelevel of the second node ND2 may have a second voltage levelcorresponding to the fourth resistor R4. The first ADC 231 may generatethe first digital signal IN1 d by performing ADC on the first voltagesignal IN1 a corresponding to the voltage level of the first node ND1and the second ADC 232 may generate the second digital signal IN2 d byperforming ADC on the second voltage signal IN2 a corresponding to thevoltage level of the second node ND2. The foreign object detection block240 may calculate a first normal impedance between the SBU1 pin A8 andthe ground voltage terminal VSSA according to the first digital signalIN1 d and calculate a second normal impedance between the SBU2 pin B8and the ground voltage terminal VSSA according to the second digitalsignal IN2 d.

On the other hand, in a state in which there is a foreign object on theSBU1 pin A8 or the SBU2 pin B8, the SBU1 pin A8 or the SBU2 pin B8 maybe abnormally electrically connected to an adjacent pin. At this time,the voltage level of the first node ND1 may not correspond to the firstvoltage level, or the voltage level of the second node ND2 may notcorrespond to the second voltage level. Accordingly, the first digitalsignal IN1 d may be different from the first digital signal IN1 d in thenormal state, or the second digital signal IN2 d may be different fromthe second digital signal IN2 d in the normal state. The foreign objectdetection block 240 may calculate the first impedance between the SBU1pin A8 and the ground voltage terminal VSSA according to the firstdigital signal IN1 d, wherein the first impedance is different from afirst normal impedance. The foreign object detection block 240 maycalculate a second impedance between the SBU2 pin B8 and the groundvoltage terminal VSSA according to the second digital signal IN2 d,wherein the second impedance may be different from a second normalimpedance. Therefore, the foreign object detection block 240 maydetermine that a foreign object is detected on a connector, and mayactivate the detection signal.

FIG. 9A shows an example of a detection circuit 200 c measuring both endvoltage of an impedance between a selected first pin and a selectedsecond pin, according to some example embodiments. FIG. 9B is anequivalent circuit diagram of FIG. 9A.

Referring to FIGS. 9A and 9B, the detection circuit 200 c may measureboth end voltage of an impedance between a selected first pin and aselected second pin. For example, the selected first pin may be the DPpin A6, and the selected second pin may be the DM pin A7. Specifically,the first selector 211 may select the DP pin A6 according to a firstinput selection signal INSEL1, and may output the first input IN1 fromthe selected DP pin A6. The second selector 212 may select the DM pin A7according to a second input selection signal INSEL2 and output thesecond input IN2 from the selected DM pin A7. For example, the firstinput selection signal INSEL1 may be ‘100’ and the second inputselection signal INSEL2 may be ‘101’.

The first and second pull-up selection signals PU1 and PU2 and the firstand second pull down selection signals PD1 and PD2 may be inactivated.Accordingly, the first and second nodes ND1 and ND2 may not be connectedto the pull-up circuit 221 and the pull-down circuit 222, respectively.The first connection selection signal SEL1 may be activated and thesecond connection selection signal SEL2 may be inactivated. Accordingly,the first connection selection switch SW5 may be turned on and thesecond connection selection switch SW6 may turned off.

In a normal state in which there is no foreign object on the DP pin A6and the DM pin A7, a voltage level of the first node ND1 may have afirst normal voltage level according to the fifth resistor R5 and avoltage level of the second node ND2 may have a second normal voltagelevel corresponding to a voltage level of the DM pin A7. The foreignobject detection block 240 may calculate a normal impedance between theDP pin A6 and the DM pin A7 based on the first and second digitalsignals IN1 d and IN2 d.

On the other hand, the DP pin A6 and the DM pin A7 may be abnormallyelectrically connected or the DP pin A6 or the DM pin A7 and an adjacentpin may be abnormally electrically connected, in a state where there isa foreign object on the DP pin A6 or the DM pin A7. At this time, thevoltage level of the first node ND1 may not correspond to the firstnormal voltage level, or the voltage level of the second node ND2 maynot correspond to the second normal voltage level. Accordingly, theimpedance calculated by the foreign object detection block 240 may bedifferent from the normal impedance. Therefore, the foreign objectdetection block 240 may determine that the foreign object is detected ona connector and may activate a detection signal.

FIG. 10A shows an example of a detection circuit 200 d measuring whetherselected first and second pins are open using the pull-up circuit,according to some example embodiments. FIG. 10B is an equivalent circuitdiagram of FIG. 10A.

Referring to FIGS. 10A and 10B, the detection circuit 200 d may measurewhether selected first and second pins are open. For example, theselected first pin may be the SBU1 pin A8 and the selected second pinmay be the SBU2 pin B8. The first and second pull-up selection signalsPU1 and PU2 may be activated and the first and second pull-downselection signals PD1 and PD2 may be inactivated. Accordingly, the firstand second nodes ND1 and ND2 may be connected to the pull-up circuit 221and not to the pull-down circuit 222. At this time, the first and secondsource selectors 2211 and 2212 may select the first and second resistorsR1 and R2 as pull-up devices, respectively. The first and secondconnection selection signals SEL1 and SEL2 may be inactivated and thefirst and second nodes ND1 and ND2 may not be connected to theconnection circuit 223.

In some example embodiments, the SBU1 pin A8 and the SBU2 pin B8 may bein an open state in a normal state where there is no foreign object onthe SBU1 pin A8 and the SBU2 pin B8. At this time, a voltage level ofthe first node ND1 may have a first normal voltage level according to apower supply voltage and the first resistor R1, and a voltage level ofthe second node ND2 may have a second normal voltage level according tothe power supply voltage and the second resistor R2.

On the other hand, in a state where there is a foreign object on theSBU1 pin A8 or the SBU2 pin B8, the SBU1 pin A8 or the SBU2 pin B8 andan adjacent pin may be abnormally electrically connected. At this time,the voltage level of the first node ND1 may not correspond to the firstnormal voltage level, or the voltage level of the second node ND2 maynot correspond to the second normal voltage level. Therefore, theforeign object detection block 240 may determine that the foreign objectis detected on a connector, and may activate a detection signal.

FIG. 11A shows an example of a detection circuit 200 e measuring whetherselected first and second pins are open using the pull-up circuit andthe pull-down circuit, according to some example embodiments. FIG. 11Bis an equivalent circuit diagram of FIG. 11A.

Referring to FIGS. 11A and 11B, the detection circuit 200 e may measurewhether selected first and second pins are opened. For example, theselected first pin may be the SBU1 pin A8 and the selected second pinmay be the SBU2 pin B8. The first and second pull-up selection signalsPU1 and PU2 and the first and second pull-down selection signals PD1 andPD2 may all be activated. Accordingly, the first and second nodes ND1and ND2 may be connected to the pull-up circuit 221 and the pull-downcircuit 222, respectively. The first and second connection selectionsignals SEL1 and SEL2 may be inactivated and the first and second nodesND1 and ND2 may not be connected to the connection circuit 223.

In some example embodiments, the SBU1 pin A8 and the SBU2 pin B8 may bein an open state in a normal state where there is no foreign object onthe SBU1 pin A8 and the SBU2 pin B8. At this time, a voltage level ofthe first node ND1 may have a first normal voltage level distributedfrom a power supply voltage by the first and third resistors R1 and R3,and a voltage level of the second node ND2 may have a second normalvoltage level distributed from the supply voltage by the second andfourth resistors R2 and R4.

On the other hand, in a state where there is a foreign object on theSBU1 pin A8 or the SBU2 pin B8, the SBU1 pin A8 or the SBU2 pin B8 andan adjacent pin may be abnormally electrically connected. At this time,the voltage level of the first node ND1 may not correspond to the firstnormal voltage level, or the voltage level of the second node ND2 maynot correspond to the second normal voltage level. Accordingly, theforeign object detection block 240 may determine that the foreign objectis detected on a connector and may activate a detection signal.

FIG. 12A shows an example of a detection circuit 200 f measuring leakagecurrent of selected first and second pins, according to some exampleembodiments, and FIG. 12B is an equivalent circuit diagram of FIG. 12A.

Referring to FIGS. 12A and 12B, the detection circuit 200 f may measureleakage current of selected first and second pins. For example, theselected first pin may be the SBU1 pin A8 and the selected second pinmay be the SBU2 pin B8. The first and second pull-up selection signalsPU1 and PU2 and the first and second pull-down selection signals PD1 andPD2 may all be activated. Accordingly, the first and second nodes ND1and ND2 may be connected to the pull-up circuit 221 and the pull-downcircuit 222, respectively. At this time, the first and second sourceselectors 2211 and 2212 may select the first and second current sourcesCS1 and CS2 as pull-up devices, respectively, and first and second syncselectors 2221 and 2222 may select the third and fourth resistors R3 andR4 as pull-down devices, respectively. The first and second connectionselection signals SEL1 and SEL2 may be inactivated and the first andsecond nodes ND1 and ND2 may not be connected to the connection circuit223.

In some example embodiments, the SBU1 pin A8 and the SBU2 pin B8 may bein an open state in a normal state where there is no foreign object onthe SBU1 pin A8 and the SBU2 pin B8. At this time, a voltage level ofthe first node ND1 may have a first normal voltage level according to aproduct of first current output from the first current source CS1 andthe third resistor R3, and a voltage level of the second node ND2 mayhave a second normal voltage level according to a product of secondcurrent output from the second current source CS2 and the fourthresistor R4.

On the other hand, in a state where there is a foreign object on theSBU1 pin A8 or the SBU2 pin B8, the SBU1 pin A8 or the SBU2 pin B8 andan adjacent pin may be abnormally electrically connected. At this time,the voltage level of the first node ND1 may not correspond to the firstnormal voltage level, or the voltage level of the second node ND2 maynot correspond to the second normal voltage level. Accordingly, theforeign object detection block 240 may determine that the foreign objectis detected on a connector and may activate a detection signal.

FIG. 13 shows an example of a detection circuit 200 g measuring thevoltages of selected first and second pins, according to some exampleembodiments.

Referring to FIG. 13, the detection circuit 200 g may measure voltage ofa selected first pin and voltage of a selected second pin. For example,the selected first pin may be the DP pin A6, and the selected second pinmay be the DM pin A7. The first and second pull-up selection signals PU1and PU2 and the first and second pull-down selection signals PD1 and PD2may be deactivated. The first and second nodes ND1 and ND2 may not beconnected to the pull-up circuit 221 and the pull-down circuit 222,respectively. The first and second connection selection signals SEL1 andSEL2 may be inactivated. The first and second nodes ND1 and ND2 may notbe connected to the connection circuit 223.

In a normal state in which there is no foreign object on the DP pin A6and the DM pin A7, a voltage level of the first node ND1 may have afirst normal voltage level that is the same as a voltage level of the DPpin A6 and a voltage level of the second node ND2 may have a secondnormal voltage level that is the same as a voltage level of the DM pinA7.

On the other hand, the DP pin A6 and the DM pin A7 may be abnormallyelectrically connected or the DP pin A6 or the DM pin A7 and an adjacentpin may be abnormally electrically connected in a state where there is aforeign object on the DP pin A6 or the DM pin A7. At this time, avoltage level of the first node ND1 may not correspond to the firstnormal voltage level, or a voltage level of the second node ND2 may notcorrespond to the second normal voltage level. Accordingly, the foreignobject detection block 240 may determine that the foreign object isdetected on a connector and may activate a detection signal.

FIG. 14 is a block diagram illustrating an example 200C of the detectioncircuit 200 of FIG. 3 including an alarm message generator, according tosome example embodiments.

Referring to FIG. 14, the detection circuit 200C may further include analarm message generator 250 as compared with the detection circuit 200of FIG. 3. In some example embodiments, the detection circuit 200C maybe implemented as part of a PDIC. The above description with referenceto FIGS. 3 to 13 may be applied to FIG. 14, and redundant descriptionswill be omitted. According to some example embodiments, operationsdescribed herein as being performed by the alarm message generator 250may be performed by at least one processor (e.g., the applicationprocessor 300) executing program code that includes instructionscorresponding to the operations. The instructions may be stored in amemory. According to some example embodiments, operations describedherein as being performed by the alarm message generator 250 may beperformed by a MCU executing stored firmware instructions.

The alarm message generator 250 may receive the detection signal DS fromthe foreign object detection block 240 and generate a foreign objectalarm message informing a user that there is a foreign object on aconnector based on the received detection signal DS. In some exampleembodiments, the foreign object alarm message may be implemented as avisual signal, an audible signal or vibration that may be recognized bythe user, and may be provided to the user through a display, a speaker,or the like of an electronic device. Also, the alarm message generator250 may limit voltage or current supplied to a VBUS pin among aplurality of pins.

FIG. 15 is a block diagram illustrating a detection circuit 400according to some example embodiments.

Referring to FIG. 15, the detection circuit 400 may include a selectioncircuit 410, a voltage signal generation circuit 420, a convertingcircuit 430, and a foreign object detection block 440. The VBUS pin A4may be connected to the voltage signal generation circuit 420. Thevoltage signal generation circuit 420 may receive the first input IN1from the VBUS pin A4. The selection circuit 410 may select one of aplurality of pins PN′. The voltage signal generation circuit 420 mayreceive the second input IN2 from the pin selected by the selectioncircuit 410. For example, the plurality of pins PN′ may be the CC1 pinA5, the CC2 pin B5, the SBU1 pin A8, the SBU2 pin B8, the DP pin A6, theDM pin A7, and the GND pin A1, but some example embodiments are notlimited thereto. In some example embodiments, the foreign objectdetection block 440 may be implemented as a MCU or other hardware. Theoperations described herein as being performed by the foreign objectdetection block 440 may be performed by the MCU executing firmwareinstructions stored in a memory.

The voltage signal generation circuit 420 may receive the first andsecond inputs IN1 and IN2 and generate first and second voltage signalsIN1 a and IN2 a corresponding to the received first and second inputsIN1 and IN2, respectively. Specifically, the voltage signal generationcircuit 420 may include a connection circuit 421 and a pull-down circuit422. A configuration of the voltage signal generation circuit 420 willbe described in detail with reference to FIG. 16.

The converting circuit 430 may receive the first and second voltagesignals IN1 a and IN2 a and perform ADC on the received first and secondvoltage signals IN1 a and IN2 a to generate the first and second digitalsignals IN1 d and IN2 d. The foreign object detection block 440 maycalculate impedance between the VBUS pin A4 and the selected pin basedon the first and second digital signals IN1 d and IN2 d. Also, theforeign object detection block 440 may generate the detection signal DSindicating presence or absence of a foreign object on a connector basedon the calculated impedance. In some example embodiments, the detectioncircuit 400 may further include an alarm message generator, asillustrated in FIG. 14.

FIG. 16 is a circuit diagram showing the detection circuit 400 of FIG.15, according to some example embodiments.

Referring to FIG. 16, the detection circuit 400 may be electricallyconnected to the VBUS pin A4 and the plurality of pins PN′. In oneexample, the plurality of pins PN′ may be the CC1 pin A5, the CC2 pinB5, the SBU1 pin A8, the SBU2 pin B8, the DP pin A6, the DM pin A7, andthe GND pin A1. In another example, the plurality of pins PN′ may be theCC1 pin A5, the CC2 pin B5, the SBU1 pin A8, the SBU2 pin B8, the DP pinA6, the DM pin A7, the VBUS pin A9 and the GND pin A1. However, typesand number of the pins PN′ connected to the detection circuit 400 may bevariously changed according to some example embodiments. Further, insome example embodiments, the detection circuit 400 may be fixedlyconnected to a pin other than the VBUS pin A4.

The selection circuit 410 may be implemented as a single selector. Theselector may select one of the plurality of pins PN′ according to theinput selection signal INSEL and output the second input IN2 from theselected pin. In some example embodiments, the selector may beimplemented as a multiplexer. In some example embodiments, the inputselection signal INSEL may be a 3-bit digital signal. Thus, thedetection circuit 400 may select first and second pins of the pluralityof pins, wherein the first pin may be a fixed pin, for example, the VBUSpin A4, and the second pin may be a variable pin.

The connection circuit 421 may include the fifth resistor R5 and thefirst connection selection switch SW5. The fifth resistor R5 and thefirst connection selection switch SW5 may be disposed between the firstand second nodes ND1 and ND2 and may be connected in series with eachother. The first connection selection switch SW5 may be turned on/offaccording to the first connection selection signal SEL1. The pull-downcircuit 422 may include the fourth resistor R4 and the second pull downselection switch SW4 that are connected to the ground voltage terminalVSSA. The second pull down selection switch SW4 may connect the fourthresistor R4 to the second node ND2 according to the second pull-downselect signal PD2.

The converting circuit 430 may include first and second ADCs 431 and432. The first ADC 431 may receive a first voltage signal IN1 a of thefirst node ND1 and perform ADC on the received first voltage signal IN1a to generate a first digital signal IN1 d. The second ADC 432 mayreceive a second voltage signal IN2 a of the second node ND2 and performADC on the received second voltage signal IN2 a to generate a seconddigital signal IN2 d.

FIG. 17 is a block diagram illustrating an electronic device 10 aincluding a PDIC, according to some example embodiments.

Referring to FIG. 17, the electronic device 10 a may include theconnector 100 and a PDIC 500. The PDIC 500 may include the detectioncircuit 200, a controller 260, and a memory 270. The connector 100 andthe detection circuit 200 may correspond to the connector 100 and thedetection circuit 200 of FIG. 1, and the above description withreference to FIGS. 1 to 16 may also be applied to FIG. 17.

In some example embodiments, the controller 260 may generate the firstand second input selection signals INSEL1 and INSEL2, the first andsecond source select signals SRC1 and SRC2, the first and second syncselection signals SNK1 and SNK2, the first and second pull-up selectionsignals PU1 and PU2, and the first and second pull-down selectionsignals PD1 and PD2, and the first and second connection selectionsignals SEL1 and SEL2. In some example embodiments, the foreign objectdetection block 240 may be implemented as part of the controller 260. Insome example embodiments, the memory 270 may store firmware forcontrolling an operation of the foreign object detection block 240. Insome example embodiments, the memory 270 may store firmware to generatea foreign object alarm message when a foreign object is present in theconnector 100 or to limit voltage or current provided to a VBUS pin of aplurality of pins on the connector 100. In some example embodiments, thecontroller 260 and the memory 270 may be implemented as MCUs.

FIG. 18 is a block diagram illustrating an electronic device 10 bincluding a PDIC, an AP, an IF-PMIC and a PMIC, according to someexample embodiments.

Referring to FIG. 18, the electronic device 10 b may include theconnector 100, the PDIC 500, the AP 300, an IF-PMIC 600, and a PMIC 700.The connector 100 and the PDIC 500 may correspond to the connector 100and the PDIC 500 of FIG. 17, respectively, and the above descriptionwith reference to FIGS. 1 to 17 may also be applied to FIG. 18. In someexample embodiments, the PDIC 500 or the AP 300 may provide a controlsignal to limit boosting of a VBUS pin to the IF-PMIC 600, and theIF-PMIC 600 may control voltage or current supplied to the VBUS pin inresponse to the control signal.

FIG. 19 is a flowchart showing a foreign object detection method of anelectronic device according to some example embodiments.

Referring to FIG. 19, the foreign object detection method of theelectronic device according to some example embodiments is a method ofdetecting a case where some of a plurality of pins on a connector areopened or short-circuited by a foreign object on the connector of theelectronic device, and for example, may include operations time seriallyperformed by the electronic device 10 of FIG. 1 or the electronic device10 a of FIG. 17. The above description with reference to FIGS. 1 to 18may also be applied to FIG. 19, and a redundant description will beomitted.

In operation S110, a foreign object detection operation is performed. Insome example embodiments, the foreign object detection operation mayrefer to an operation of selecting first and second pins of a pluralityof pins on a connector and measuring a pin-to-pin impedance between theselected first and second pins. In some example embodiments, the foreignobject detection operation may further include an operation ofdetermining whether a foreign object is present based on the measuredpin-to-pin impedance. For example, the detection circuit 200 may performthe foreign object detection operation. The foreign object detectionoperation will be described in more detail with reference to FIG. 20.

In operation S120, it is determined whether the foreign object isdetected on the connector. For example, it may be determined whether theforeign object is detected based on the detection signal DS output fromthe foreign object detection block 240. As a result of thedetermination, if the foreign object is detected on the connector,operation S130 is performed; otherwise operation S160 is performed.

In operation S130, a foreign object alarm message is generated. Forexample, the foreign object alarm message may be implemented as a visualsignal, an audible signal or vibration that may be recognized by a user,and may be provided to the user through a display, a speaker, or thelike of the electronic device 10. In some example embodiments, theforeign object detection block 240 or the AP 300 may generate theforeign object alarm message.

In operation S140, it is determined whether the electronic device isattached to an external electronic device via a cable. For example, thedetection circuit 200 or the PDIC 500 may determine whether theelectronic device is attached based on a voltage level applied to theplurality of pins. As a result of the determination, if the electronicdevice is attached, operation S150 is performed.

In operation S150, boosting of a VBUS voltage supplied to a VBUS pin isrestricted. In some example embodiments, a voltage level or a currentlevel applied to the VBUS pin may be reduced. In some exampleembodiments, supply of the VBUS voltage applied to the VBUS pin may beblocked. For example, the detection circuit 200 or the PDIC 500, or theAP 300, may provide a control signal to limit the boosting of the VBUSvoltage to the IF-PMIC 600, and the IF-PMIC 600 may control voltage orcurrent provided to the VBUS pin in response to the control signal.

In operation S160, it is determined whether the electronic device isattached to the external electronic device via the cable. As a result ofthe determination, if the electronic device is attached, operation S170is performed; otherwise, operation S180 is performed. In operation S170,the electronic device 10 may normally communicate with ortransmit/receive power to/from the external electronic device via thecable. In operation S180, a foreign object detection time is determined.For example, the detection circuit 200 or the PDIC 500 may perform theforeign object detection operation according to a determined foreignobject detection period. As a result of the determination, if it is theforeign object detection time, operation S110 is performed, and if not,operation S170 is performed.

FIG. 20 is a flowchart illustrating a method of measuring impedanceaccording to some example embodiments.

Referring to FIG. 20, the method of measuring the impedance according tosome example embodiments may be a method of measuring the impedancebetween a plurality of pins on a connector of an electronic device, andfor example, may correspond to an example of operation S110 of FIG. 19.Also, the method of measuring the impedance according to some exampleembodiments may be time serially performed by the detection circuit 200of FIG. 1, and above description with reference to FIGS. 1 to 19 mayalso be applied to FIG. 20.

In operation S210, first and second pins of a plurality of pins areselected. In some example embodiments, the selection circuit 210 mayselect the first and second pins of the plurality of pins. However, insome example embodiments, the first pin may be determined and fixed, andthe selection circuit 410 may select one of the plurality of pins as thesecond pin. Further, in some example embodiments, the selection circuit410 may select three or more of the plurality of pins.

In operation S220, first and second analog signals correspondingrespectively to the first and second pins are generated. For example,the first analog signal may correspond to a first voltage signal of afirst node connected to the first pin, and the second analog signal maycorrespond to a second voltage signal of a second node connected to thesecond pin. In operation S230, the first and second analog signals areconverted into first and second digital signals, respectively. Inoperation S240, based on the first and second digital signals, adetection signal indicating presence or absence of a foreign object on aconnector is generated.

While some example embodiments have been particularly shown anddescribed, it will be understood that various changes in form anddetails may be made therein without departing from the spirit and scopeof the following claims.

What is claimed is:
 1. An electronic device comprising: a connectorincluding a first pin and a plurality of pins; and a detection circuitincluding: a selection circuit configured to select a second pin amongthe plurality of pins, a connection circuit between the first pin andthe second pin of the plurality of pins, and a pull-down circuitconfigured to provide a ground voltage to the second pin, the detectioncircuit configured to: measure an impedance between the first pin andthe second pin by controlling a connection of the connection circuit andthe pull-down circuit, and generate a detection signal indicating apresence or an absence of a foreign object on the connector based on themeasured impedance.
 2. The electronic device of claim 1, wherein theconnector is connectable to a USB type-C cable and is at least one of aUSB type-C receptacle or a USB type-C plug.
 3. The electronic device ofclaim 1, further comprising: an application processor configured to:receive the detection signal from the detection circuit, and perform afunction based on the received detection signal, the function includingat least one of generating a foreign object alarm message based on thereceived detection signal, or limiting voltage or current supplied tothe first pin.
 4. The electronic device of claim 1, wherein thedetection circuit is further configured to perform a function if thedetection signal indicates that the foreign object is present on theconnector, the function including at least one of generating a foreignobject alarm message, or limiting voltage or current provided to thefirst pin.
 5. The electronic device of claim 1, wherein the selectioncircuit comprises: a selector configured to select the second pin amongthe plurality of pins.
 6. The electronic device of claim 1, wherein thedetection circuit further includes: an analog-to-digital converterconfigured to generate first and second digital signals by performinganalog-to-digital conversion on a first voltage signal corresponding toa state of the first pin and a second voltage signal corresponding to astate of the second pin, and wherein the detection circuit is furtherconfigured to measure the impedance based on the first and seconddigital signals.
 7. The electric device of claim 1, where the connectioncircuit comprises: a first resistor connectable between a first nodeconnected to the first pin; and a second node connected to the secondpin.
 8. The electronic device of claim 1, wherein the pull-down circuitis connected to a ground voltage terminal in response to a pull-downselection signal.
 9. The electronic device of claim 8, wherein thepull-down circuit comprises: a second resistor connected to the groundvoltage terminal; and a pull-down switch between the second resistor anda second node connected to the second pin, wherein the pull-down switchis configured to switch according to the pull-down selection signal. 10.The electronic device of claim 1, wherein the first pin corresponds to aVBUS pin.
 11. The electronic device of claim 1, further comprising: apower delivery integrated circuit (PDIC), wherein the PDIC includes: thedetection circuit; and a controller configured to control the connectionof the connection circuit and the pull-down circuit.
 12. The electronicdevice of claim 11, wherein the PDIC further includes a memoryconfigured to store at least one of firmware for controlling a foreignobject detecting operation of the controller, firmware for generating aforeign object alarm message when the foreign object is present in theconnector, and firmware for limiting voltage or current provided to thefirst pin.
 13. A method of detecting a foreign object on a connector ofan electronic device, the connector including a first pin and aplurality of pins, the method comprising: selecting a second pin amongthe plurality of pins included in the connector; measuring an impedancebetween the first pin and the second pin by controlling a connection ofa connection circuit and a pull-down circuit; and generating a detectionsignal indicating a presence or an absence of a foreign object on theconnector based on the measured impedance, wherein the connectioncircuit is between the first pin and the second pin of the plurality ofpins, and the pull-down circuit is configured to provide a groundvoltage to the second pin.
 14. The method of claim 13, wherein themeasuring comprises: generating first and second voltage signalscorresponding to the first and second pins, respectively; converting thefirst and second voltage signals into first and second digital signals,respectively; and measuring the impedance based on the first and seconddigital signals.
 15. The method of claim 13, wherein the first pincorresponds to a VBUS pin, and wherein the method further comprises:limiting voltage or current of the VBUS pin according to the detectionsignal.
 16. The method of claim 13, further comprising: determiningwhether a cable is connected to the electronic device through theconnector; and repeating the selecting, the measuring, and thegenerating after a determined foreign object detection period.
 17. Themethod of claim 13, wherein the connector is connectable to a USB type-Ccable and is at least one of a USB type-C receptacle or a USB type-Cplug.
 18. A method of providing a foreign object alarm message of anelectronic device, the electronic device including a connector includinga first pin and a plurality of pins, the method comprising: selecting asecond pin among the plurality of pins included in the connector;measuring an impedance between the first pin and the second pin bycontrolling a connection of a connection circuit and a pull-downcircuit; generating a detection signal indicating a presence or anabsence of a foreign object on the connector based on the measuredimpedance; and providing the foreign object alarm message according tothe generated detection signal, by an alarm message generator of theelectronic device, wherein the connection circuit is between the firstpin and the second pin of the plurality of pins, and the pull-downcircuit is configured to provide a ground voltage to the second pin. 19.The method of claim 18, wherein the measuring comprises: generatingfirst and second voltage signals corresponding to the first and secondpins, respectively; converting the first and second voltage signals intofirst and second digital signals, respectively; and measuring theimpedance based on the first and second digital signals.
 20. The methodof claim 18, wherein the first pin corresponds to a VBUS pin, andwherein the method further comprises: limiting voltage or current of theVBUS pin according to the detection signal.